China Machinable Glass Ceramic Rings are precision-engineered annular components produced in China using advanced glass-ceramic technology. Composed typically of fluorophlogopite mica in a borosilicate glass matrix (or similar formulations), these rings inherit the hallmark machinability of the material class – allowing complex features (grooves, threads, holes, profiles) to be added using standard carbide tools. Designed for demanding thermal, electrical, and vacuum environments, they offer a cost-effective, high-performance solution for global industrial applications.

Key Advantages

• Precision Machinability: Core advantage - easily drilled, tapped, turned, milled, and ground to tight tolerances (±0.01-0.05mm) after sintering, enabling custom designs and rapid prototyping.

• High-Temperature Stability: Continuous operation typically up to 800°C - 1000°C (1472°F - 1832°F), suitable for furnace and process applications.

• Superior Electrical Insulation: Excellent dielectric properties, even at elevated temperatures and high frequencies.

• Exceptional Vacuum Compatibility: Extremely low outgassing (low TML & CVCM), ideal for UHV, space, and semiconductor vacuum systems.

• Controlled Thermal Expansion: CTE often engineered to match metals (e.g., stainless steel, Kovar) for reliable thermal cycling and hermetic sealing.

• Excellent Chemical Resistance: Resists most acids, alkalis, solvents, and molten metals (except HF and strong phosphoric acid).

• Non-Porous & Hermetically Sealing: Zero water absorption, inherently vacuum-tight.

• Thermal & Electrical Insulation: Low thermal conductivity, high volume resistivity.

• Non-Magnetic & Non-Sparking: Safe for MRI, sensitive instruments, explosive environments.

• Cost-Effectiveness: Competitive pricing from China's manufacturing ecosystem without compromising core performance.

• Customization: Chinese manufacturers often excel at producing bespoke sizes, geometries, and features.

Performance Characteristics (Typical Range - Varies by Manufacturer/Grade)

• Max. Continuous Operating Temp: 750°C - 1000°C (1382°F - 1832°F).

• Thermal Expansion Coefficient (CTE): 8.0 - 11.0 x 10⁻⁶/°C (25-400°C) - Often tailored for metal matching.

• Thermal Conductivity: 1.2 - 1.8 W/m·K.

• Dielectric Strength: 20 - 35 kV/mm.

• Volume Resistivity: >10¹³ Ω·cm @ 500°C.

• Dielectric Constant (1 MHz): 6.0 - 7.0.

• Dissipation Factor (1 MHz): 0.002 - 0.008.

• Density: 2.50 - 2.60 g/cm³.

• Flexural Strength: 90 - 120 MPa (13,000 - 17,500 psi).

• Compressive Strength: 350 - 450 MPa (50,000 - 65,000 psi).

• Hardness: Knoop 200 - 300.

• Water Absorption: 0%.

• Outgassing (ASTM E595): TML < 0.80%, CVCM < 0.10% (typical for quality grades).

Primary Applications

• Vacuum Systems (UHV/HV): Insulating feedthroughs, spacer rings, flange isolators, chamber supports, electrode holders.

• Semiconductor Equipment: Plasma etch focus rings, showerhead spacers, wafer handling rings, insulator bushings.

• High-Temperature Furnaces: Thermocouple insulators, heating element spacers, tube supports, viewport frames.

• Laser & Optical Systems: Mounting rings, resonator spacers, aperture holders, optical isolator components.

• Electrical & Power Engineering: High-voltage bushings, insulator rings, switchgear components, bushing supports.

• Analytical Instrumentation: Mass spectrometer components, sensor housings, chromatography furnace parts.

• Aerospace & Defense: Radome spacers, antenna insulators, sensor mounting rings (non-magnetic).

• Medical Devices: MRI componentry, X-ray tube insulators, non-magnetic fixturing rings.

• Fluid Handling: Corrosion-resistant seals, pump bushings, valve seats (for non-abrasive fluids).

• Research & Prototyping: Custom insulating/sealing rings for experimental setups.